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09-27

2019

High Frequency Characterization and Analysis of Through Silicon Vias and Coplanar, Microsystem Technologies, 22(2), 337–347, 2016
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09-27

2019

Design of a compact silicon-based integrated passive band-pass filter with two tunable finite transmission zeros, Microelectronics Journal, 49, 43-48, 2016
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09-27

2019

Study on a Conformal Shielding Structure with Conductive Adhesive Coated on Molding Compound in 3D Packages, IEEE Transactions on Electromagnetic Compatibility, 58(2), 442-447, 2016
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09-27

2019

Deep dry etching of fused silica using C4F8/Ar inductively coupled plasmas, J Mater Sci: Mater Electron, 7, 2016
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09-27

2019

Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications, Microsystem Technologies,22(1), 119–127, 2016
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09-27

2019

Diagnosis and optimization of a power distribution network by extracting its parasitic inductances and building a lumped circuit model, Microsystem Technologies, 1-8, 2015
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09-27

2019

Tunable photonic microwave generation by directly modulating a dual-wavelength amplified feedback laser, Optics Communications, 345(15 ), 57-61, 2015
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09-27

2019

Complementary metal–oxide–semiconductor compatible 1060 nm photodetector with ultrahigh gain under low bias, Optics letter, 40(19), 4440-4443, 2015
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09-27

2019

TSV Backside Reveal by a Wet Etching Process. ECS Transactions, 60(1):401-406. 2014
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09-27

2019

The effect of temporary bonding on post processing in TSV interposer manufacturing, Microsystem Technologies, 1-7, 2014
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